DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Cheol Ho | ko |
dc.contributor.author | Kwon, Young-Se | ko |
dc.date.accessioned | 2013-03-12T12:32:47Z | - |
dc.date.available | 2013-03-12T12:32:47Z | - |
dc.date.created | 2013-01-07 | - |
dc.date.created | 2013-01-07 | - |
dc.date.issued | 2012-08 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/102335 | - |
dc.description.abstract | Spiral inductors were fabricated by burying thick metals in radio frequency (RF) package substrates. The inductors consist of a 40-mu m-thick copper spiral buried in an anodized aluminum substrate and an overpass supported by a benzocyclobutene layer on top of the substrate. Due to their low ohmic loss, significantly high Q factors were obtained at 2 GHz: a Q factor of over 100 with 4.2-nH inductance (2.5-turn spiral) and a Q of 60 with 7.8-nH inductance (3.5-turn). The results demonstrate that the substrate-buried thick metal process can be a viable technique to meet the demands on cost-effective high-Q inductors compatible with conventional thin-film processes for RF integrated circuits. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | SPIRAL INDUCTORS | - |
dc.title | Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates | - |
dc.type | Article | - |
dc.identifier.wosid | 000307185900004 | - |
dc.identifier.scopusid | 2-s2.0-84864659099 | - |
dc.type.rims | ART | - |
dc.citation.volume | 2 | - |
dc.citation.issue | 8 | - |
dc.citation.beginningpage | 1260 | - |
dc.citation.endingpage | 1264 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2011.2180905 | - |
dc.contributor.localauthor | Kwon, Young-Se | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Anodized aluminum substrate | - |
dc.subject.keywordAuthor | buried thick metal | - |
dc.subject.keywordAuthor | high-Q inductor | - |
dc.subject.keywordAuthor | spiral inductor | - |
dc.subject.keywordPlus | SPIRAL INDUCTORS | - |
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