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College of Engineering(공과대학)Dept. of Bio and Brain Engineering(바이오및뇌공학과)BiS-Journal Papers(저널논문)

Solvent-Assisted Decal Transfer Lithography by Oxygen-Plasma Bonding and Anisotropic Swelling

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dc.contributor.authorKim, Pilnamko
dc.contributor.authorKwak, Rhokyunko
dc.contributor.authorLee, Sung Hoonko
dc.contributor.authorSuh, Kahp Y.ko
dc.date.accessioned2013-03-12T10:36:58Z-
dc.date.available2013-03-12T10:36:58Z-
dc.date.created2012-07-13-
dc.date.created2012-07-13-
dc.date.issued2010-06-
dc.identifier.citationADVANCED MATERIALS, v.22, no.22, pp.2426 - 2426-
dc.identifier.issn0935-9648-
dc.identifier.urihttp://hdl.handle.net/10203/102051-
dc.description.abstractSolvent-assisted decal transfer lithography (DTL) enables the formation of well-defined micro-/nanostructures over a large area (similar to 4 in. wafer) by combining irreversible oxygen bonding and anisotropic swelling of poly(dimethoxylsiloxane) (PDMS). Such swelling-induced stress gradient allows for cohesion failure of the skin layer upon removal of the stamp, leaving behind a highly uniform layer (similar to 100 nm).-
dc.languageEnglish-
dc.publisherWILEY-V C H VERLAG GMBH-
dc.subjectSTAMP DEFORMATION-
dc.subjectSCALE-
dc.subjectSUBSTRATE-
dc.subjectSURFACES-
dc.subjectADHESION-
dc.titleSolvent-Assisted Decal Transfer Lithography by Oxygen-Plasma Bonding and Anisotropic Swelling-
dc.typeArticle-
dc.identifier.wosid000279450700004-
dc.identifier.scopusid2-s2.0-77953517941-
dc.type.rimsART-
dc.citation.volume22-
dc.citation.issue22-
dc.citation.beginningpage2426-
dc.citation.endingpage2426-
dc.citation.publicationnameADVANCED MATERIALS-
dc.identifier.doi10.1002/adma.200903440-
dc.contributor.localauthorKim, Pilnam-
dc.contributor.nonIdAuthorKwak, Rhokyun-
dc.contributor.nonIdAuthorLee, Sung Hoon-
dc.contributor.nonIdAuthorSuh, Kahp Y.-
dc.type.journalArticleArticle-
dc.subject.keywordPlusSTAMP DEFORMATION-
dc.subject.keywordPlusSCALE-
dc.subject.keywordPlusSUBSTRATE-
dc.subject.keywordPlusSURFACES-
dc.subject.keywordPlusADHESION-
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