A Comprehensive Study of the Resistive Switching Mechanism in Al/TiOx/TiO2/Al-Structured RRAM

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dc.contributor.authorKim, Sung-Hoko
dc.contributor.authorChoi, Yang-Kyuko
dc.date.accessioned2013-03-12T00:32:40Z-
dc.date.available2013-03-12T00:32:40Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2009-12-
dc.identifier.citationIEEE TRANSACTIONS ON ELECTRON DEVICES, v.56, no.12, pp.3049 - 3054-
dc.identifier.issn0018-9383-
dc.identifier.urihttp://hdl.handle.net/10203/100837-
dc.description.abstractThe conduction mechanism and resistive switching properties in a resistive-random-access-memory device composed of Al(top)/TiOx/TiO2/Al(bottom) are investigated in this paper. The active-top-electrode (TE) material aluminum interacted with the TiO2 layer and induced an oxygen-deficient TiOx layer near the TE. The naturally formed oxygen-deficient TiOx layer was confirmed by a transmission-electron-microscope energy-dispersive X-ray spectrometry analysis. The oxygen-deficient TiOx region acted as a trap for electrons and contributed to the resistive switching. The proposed mechanism and measured data are verified through simulation of a two-variable resistor model.-
dc.languageEnglish-
dc.publisherIEEE-Inst Electrical Electronics Engineers Inc-
dc.subjectFILMS-
dc.titleA Comprehensive Study of the Resistive Switching Mechanism in Al/TiOx/TiO2/Al-Structured RRAM-
dc.typeArticle-
dc.identifier.wosid000271951700022-
dc.identifier.scopusid2-s2.0-77956032359-
dc.type.rimsART-
dc.citation.volume56-
dc.citation.issue12-
dc.citation.beginningpage3049-
dc.citation.endingpage3054-
dc.citation.publicationnameIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.identifier.doi10.1109/TED.2009.2032597-
dc.contributor.localauthorChoi, Yang-Kyu-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorOxygen vacancy-
dc.subject.keywordAuthorresistive random access memory (RRAM)-
dc.subject.keywordAuthorresistive switching-
dc.subject.keywordAuthorTiOx-
dc.subject.keywordPlusFILMS-
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