DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Moon Gi | ko |
dc.contributor.author | Seo, Sun-Kyoung | ko |
dc.contributor.author | Lee, HyuckMo | ko |
dc.date.accessioned | 2013-03-12T00:23:28Z | - |
dc.date.available | 2013-03-12T00:23:28Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-04 | - |
dc.identifier.citation | JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516 | - |
dc.identifier.issn | 0925-8388 | - |
dc.identifier.uri | http://hdl.handle.net/10203/100813 | - |
dc.description.abstract | Under bump metallurgies (UBMs) made of Cu-10Zn and Cu-20Zn (numbers are all in weight percent unless specified otherwise) are proposed. After a reaction with Sn-0.7Cu and Sn-3.8Ag-0.7Cu solders, the wettability and interfacial reactions during reflow and aging were compared with those of a pure Cu UBM. The wettability of both solders on Cu-10Zn and Cu-20Zn decreased by about 30% even though they were reflowed under the same conditions. The total thickness of the intermetallic compounds (IMCs: Cu(6)Sn(5) plus Cu(3)Sn) at the interface during reflow was significantly reduced by the reaction with the Cu-Zn UBMs, and this reduction is attributed to the large reduction of the growth of Cu(3)Sn IMCs in both solder joints. Moreover, when the Zn content was increased to 20wt.% in the Cu-xZn UBM, the growth of Cu(6)Sn(5) as well as Cu(3)Sn was retarded during aging, and thus the thickness of the total IMCs was significantly reduced. In addition, the first-forming IMC on the Cu-Zn UBMs during the reflow, was calculated thermodynamically and compared with the experimental results. (C) 2008 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | AG-CU | - |
dc.subject | JOINTS | - |
dc.subject | ZN | - |
dc.subject | MICROSTRUCTURE | - |
dc.subject | PREDICTION | - |
dc.subject | STRENGTH | - |
dc.title | Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies | - |
dc.type | Article | - |
dc.identifier.wosid | 000266952000103 | - |
dc.identifier.scopusid | 2-s2.0-61649119014 | - |
dc.type.rims | ART | - |
dc.citation.volume | 474 | - |
dc.citation.issue | 1-2 | - |
dc.citation.beginningpage | 510 | - |
dc.citation.endingpage | 516 | - |
dc.citation.publicationname | JOURNAL OF ALLOYS AND COMPOUNDS | - |
dc.identifier.doi | 10.1016/j.jallcom.2008.06.141 | - |
dc.contributor.localauthor | Lee, HyuckMo | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Metals and alloys | - |
dc.subject.keywordAuthor | Liquid-solid reactions | - |
dc.subject.keywordAuthor | Solid state reactions | - |
dc.subject.keywordAuthor | Intermetallics | - |
dc.subject.keywordPlus | AG-CU | - |
dc.subject.keywordPlus | JOINTS | - |
dc.subject.keywordPlus | ZN | - |
dc.subject.keywordPlus | MICROSTRUCTURE | - |
dc.subject.keywordPlus | PREDICTION | - |
dc.subject.keywordPlus | STRENGTH | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.