Showing results 87341 to 87360 of 109619
Trustworthy Residual Vehicle Value Prediction for Auto Finance Kim, Mihye; Choi, Jimyung; Kim, Jaehyun; Kim, Wooyoung; Baek, Yeonung; Bang, Gisuk; Son, Kwangwoon; et al, 37th AAAI Conference on Artificial Intelligence, AAAI 2023, pp.15537 - 15544, Association for the Advancement of Artificial Intelligence, 2022-10-07 |
Trypsin free bMSC cell sheet detachment on OTS pattern dish 연제민; 임성갑; 박성현, 2023 한국고분자학회 춘계 총회 및 학술대회, 한국고분자학회, 2023-04-07 |
TSC Simulation of Vertical Instability and Active control for KSTAR 장충석, Bull. Kor. Phys. Soc., pp.131 - 131, 1997 |
TSPipe: Learn from Teacher Faster with Pipelines Lim, Hwijoon; Kim, Yechan; YUN, SUKMIN; Shin, Jinwoo; Han, Dongsu, The 39th International Conference on Machine Learning (ICML 2022), pp.13302 - 13312, PMLR, 2022-07 |
TSPipe: Learn from Teacher Faster with Pipelines Lim, Hwijoon; Kim, Yechan; YUN, SUKMIN; Shin, Jinwoo; Han, Dongsu, The 39th International Conference on Machine Learning, ICML 2022, International Conference on Machine Learning, 2022-07-20 |
TSS BVHs: Tetrahedron Swept Sphere BVHs for Ray Tracing Subdivision Surfaces Du, Peng; Yoon, Sung Eui; Kim, Young Joon, Pacific Conference on Computer Graphics and Applications, Pacific Grahpics, 2016-10-12 |
TSUIMS: Implementaion of the UIMS for the Touch Screen Lee, J.; Kim, J.W.; Wohn, Kwang-Yun, 한국정보과학회 HCI 학술대회, pp.109 - 125, 한국정보과학회, 1993 |
TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 |
TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections Pak, Jun So; Cho J.; Kim J.; Lee J.; Lee H.; Park K.; Kim J., 2010 IEEE CPMT Symposium Japan, ICSJ10, 2010-08-24 |
TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
TSV-based Decoupling Capacitor Schemes in 3D-IC Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
TTA-COPE: Test-Time Adaptation for Category-Level Object Pose Estimation Lee, Taeyeop; Tremblay Jonathan; Blukis, Valts; Wen Bowen; Lee, ByeongUk; Shin, Inkyu; Birchfield Stan; et al, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR 2023), IEEE/CVF, 2023-06-21 |
TTCN판정의 변별력에 대하여 강성원; 김명철; 박용범, COMSW'97(통신학회 주관), 한국통신학회, 1997 |
TTIP의 열분해에 있어 알콜첨가에 의한 TiO2 입자크기 조절 C-33 김기영; 박승빈, 한국화학공학회 1994년 춘계, 1994 |
Ttoal Synthesis of natural Polyquinanes Using Radical Reactions of Aziridinyl Imines: The Synthesis of $dl$-Modhephene (Abstract) 이희윤, The 77th Congress of the Korean Chemical Society, 1990 |
TTX 판토그라프 틸팅 구조물의 경량화 설계 이민수; 한재흥; 김기남; 고태환, 한국철도학회 2005년도 추계학술대회, 한국철도학회, 2005-10 |
TubeFormer-DeepLab: Video Mask Transformer Kim, Dahun; Xie, Jun; Wang, Huiyu; Qiao, Siyuan; Yu, Qihang; Kim, Hong-Seok; Adam, Hartwig; et al, 2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), IEEE Computer Society, 2022-06-24 |
Tumbling and defects of liquid crystalline polymer under shear flow Chung, In Jae, Korea-Australia Workshop on Rheology, pp.9 - 13, 1998 |
Tumblr Blog Recommendation with Boosted Inductive Matrix Completion Shin, Donghyuk; Cetintas, Suleyman; Lee, Kuang-Chih; Dhillon, Inderjit S., CIKM'15: 24th ACM International Conference on Information and Knowledge Management, ACM, 2015-10-19 |
Tumor capturing microbeads for postsurgical care Cha, Junghwa; Kim, Pilnam, 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2018, pp.1899 - 1901, Chemical and Biological Microsystems Society, 2018-11 |
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