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| Thermomechanical analysis of laser-generated ultrasonics in thin structures by finite element method = 유한요소방법을 이용한 얇은 판 구조물에서의 레이저 유도 초음파의 열기계학적 해석link Lim, Hyeong-Uk; 임형욱; et al, 한국과학기술원, 2014 |
| Thermomechanical Behavior of Alkali-Activated Concrete under High Temperatures : An Overview Kim, JS; Lee, Haeng-Ki; Park, SM, The 4th International Conference on Computational Design in Engineering (CODE2018), COSEIK, 2018-04-02 |
| Thermomechanical behavior of alkali-activated slag/fly ash composites with PVA fibers exposed to elevated temperatures Kim, J.S.; Lee, Haeng-Ki, ADVANCES IN CONCRETE CONSTRUCTION, v.11, no.1, pp.11 - 18, 2021-01 |
| Thermomechanical Behavior of Poly(3-hexylthiophene) Thin Films on the Water Surface Ma, Boo Soo; Lee, Jin-Woo; Park, Hyeonjung; Kim, Bumjoon J.; Kim, Taek-Soo, ACS OMEGA, v.7, no.23, pp.19706 - 19713, 2022-06 |
| Thermomechanical Behavior of PVA fiber Reinforced Alkali-Activated Concrete 김진성; 박솔뫼; 이행기, 한국콘크리트학회 2018 가을 학술대회, 한국콘크리트학회, 2018-11-08 |
| Thermomechanical Behavior of Shape Adaptive Structures with SMA Actuator Lee, In; Roh, J. H.; Yang, S. M.; Han, Jae-Hung, 6th International Congress on Thermal Stress, Vienna University of Technology v. no. , Technische Universitat Wien, 2005-05 |
| Thermomechanical Behaviors and Antiferroelectric Superstructures in Pb(Yb1/2Nb1/2)O3- Pb(Fe1/2Nb1/2)O3 Solution System Choo, Woong Kil; H. Lim; K.S. Koh; J.R. Kwon, FERROELECTRICS, v.155, pp.249 - 254, 1994 |
| Thermomechanical Behaviors of Ni-Ti Shape Memory Alloy Ribbons and Their Numerical Modeling Roh, J. H.; Han, Jae-Hung; Lee, In, International Conference on technology Fusion, Artificial Muscle Research Center, 2006-05 |
| Thermomechanical Behaviors of Shape Memory Alloy Thin Films and Their Application Roh Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.7, no.1, pp.91 - 98, 2006-06 |
| Thermomechanical Fatigue and Heat Generation Bahavior of Filled Rubber Vulcanizates during Cyclic Deformation Park, DM; Hong, Won-Hi; Kim, SG; Kim, HJ, International Rubber Conference 99, pp.699 - 702, 1999-04-01 |
| Thermomechanical fatigue behavior of ferritic stainless steel Lee, Soon-Bok; Lee, Keum-Oh; Hong, Seong-Gu; Yoon, Samson; Kim, Bong-Soo, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.190 - 190, 2004 |
| Thermomechanical fatigue behavior of the ferritic stainless steel Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005 |
| Thermomechanical Fatigue Deformation Approach Using Bi-Linear Model Lee, Soon-Bok; Lee, Keum-Oh, Tokyo Tech-KAIST joint workshop, pp.38 - 39, 2005 |
| Thermomechanical Fatigue of the Ferritic Stainless Steel 429EM Lee, Soon-Bok; Lee, Keum-oh; Yoon, Samson, FEOFS 2003, 2003 |
| Thermomechanical Manipulation of Electric Transport in MoTe2 Kim, Dohyun; Lee, Jun-Ho; Kang, Kyungrok; Won, Dongyeun; Kwon, Min; Cho, Suyeon; Son, Young-Woo; et al, ADVANCED ELECTRONIC MATERIALS, v.7, no.4, 2021-04 |
| Thermomechanical properties and mechanical stresses of Ge2Sb2Te5 films in phase-change random access memory Park, Il-Mok; Jung, Jung-Kyu; Ryu, Sang-Ouk; Choi, Kyu-Jeong; Yu, Byoung-Gon; Park, Young-Bae; Han, Seung Min J.; et al, THIN SOLID FILMS, v.517, no.2, pp.848 - 852, 2008-11 |
| Thermomechanical properties of chemically modified graphene/poly(methyl methacrylate) composites made by in situ polymerization Potts, Jeffrey R.; Lee, Sun Hwa; Alam, Todd M.; An, Jinho; Stoller, Meryl D.; Piner, Richard D.; Ruoff, Rodney S., CARBON, v.49, no.8, pp.2615 - 2623, 2011-07 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package Lee, K-O., JOURNAL OF ELECTRONIC MATERIALS, v.41, no.4, pp.706 - 711, 2012 |
| Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
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