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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection Aryan, Pouria; Sampath, Santhakumar; Sohn, Hoon, SENSORS, v.18, no.7, 2018-07 |
Thermography-based coating thickness estimation for steel structures using model-agnostic meta-learning Lee, Jun; Hwang, Soonkyu; Kim, Kiyoung; Sohn, Hoon, SMART STRUCTURES AND SYSTEMS, v.32, no.2, pp.123 - 133, 2023-08 |
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