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(A) study on the new manufacturing process for flexible printed circuit board (PCB) and the effects of copper oxide on mechanical reliability of Cu/PI interface = 다층 연성기판의 제조 공정 및 구리산화물이 구리/폴리이미드 계면의 신뢰성에 미치는 영향에 관한 연구link Lee, Hyuek-Jae; 이혁재; et al, 한국과학기술원, 2006 |
Mechanism and Kinetics of Oxidation Reaction of Aqueous Ti3C2Tx Suspensions at Different pHs and Temperatures Doo, Sehyun; Chae, Ari; Kim, Daesin; Oh, Taegon; Ko, Tae Yun; Kim, Seon Joon; Koh, Dong-Yeun; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.19, pp.22855 - 22865, 2021-05 |
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