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Due-date based scheduling methods in a leadframe manufacturing System = 리드프레임 생산 시스템에서의 납기를 고려한 일정계획에 관한 연구link Lee, Eun-Young; 이은영; et al, 한국과학기술원, 2001 |
Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
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