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Showing results 1 to 9 of 9

1
An efficient crosstalk parameter extraction method for high-speed interconnection lines

Sung, M.; Ryu, W.; Kim, H.; Kim, J.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.148 - 155, 2000-05

2
Design and implementation of a logging interface for an open content delivery interconnection system = 개방형 콘텐츠 전달 상호접속시스템을 위한 로깅 인프라 설계 및 구현link

Ebido, Timothy-John; Ebido Timothy; et al, 한국과학기술원, 2013

3
Design and understanding of Anisotropic Conductive Films (ACFs) for LCD packaging

Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.21, no.2, pp.226 - 234, 1998-06

4
Low-power network-on-chip for high-performance SoC design

Lee, Kang-Min; Lee, Se-Joong; Yoo, Hoi-Jun, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.14, pp.148 - 160, 2006-02

5
Multi-Stage Organic Logic Circuits Using Via-Hole-Less Metal Interconnects

Park, Hongkeun; Yoo, Hocheon; Lee, Chungryeol; Kim, Jae-Joon; Im, Sung Gap, IEEE ELECTRON DEVICE LETTERS, v.41, no.11, pp.1685 - 1687, 2020-11

6
Novel Electronics for Flexible and Neuromorphic Computing

Lee, Haneol; Park, Jung Hwan; Kim, Tae Jin; Im, Doyoung; Shin, Jung Ho; Kim, Do Hyun; Mohammad, Baker; et al, ADVANCED FUNCTIONAL MATERIALS, v.28, no.32, 2018-08

7
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure

Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01

8
Slot transmission line model of interconnection line crossing split ground plane on high-speed multi-layer board = 고속 다층기판에서 분할된 접지 평면 위를 지나는 인터커넥션의 슬롯라인 모델link

Kim, Jin-Gook; 김진국; et al, 한국과학기술원, 2002

9
이동망과 고정망의 상호접속기준에 관한 연구 = A study on the interconnection regulations between the mobile networks and local loop carrierlink

이충식; Lee, Chung-Sig; 김재철; 전덕빈; et al, 한국과학기술원, 2002

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