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Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test Kim, Kwang-Seop; Kang, Ji-Hoon; Choi, Dae-Geun; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.88, no.6, pp.855 - 860, 2011-06 |
Effects of thermal treatment on the tribological characteristics of thermoplastic polymer film Kim, Kwang-Seop; Heo, Jung-Chul; Kim, Kyung-Woong, THIN SOLID FILMS, v.519, no.18, pp.5988 - 5995, 2011-07 |
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