Browse by Subject Thermal management
Showing results 1 to 10 of 10
| A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications Ki, Seokkan; Lee, Jooyoung; Ryu, Seunggeol; Bang, Soosik; Kim, Kichong; Nam, Youngsuk, INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v.161, 2021-03 |
| Architectural approach for dynamic thermal management at high density rack-mounted servers = 고밀집 서버에서의 동적 열관리를 위한 구조적 접근방법link Choi, Jeong-Hwan; 최정환; et al, 한국과학기술원, 2007 |
| Developing an Integrated Design Strategy for Chip Layout Optimization Wits, W. W.; Jauregui-Becker, J. M.; Vliet, F. E. van; Riele, G. J. te, 21st CIRP Design Conference, 2011 |
| Experimental investigation on thermal-hydraulic performance of manifold microchannel with pin-fins for ultra-high heat flux cooling Lee, Young Jin; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.224, 2024-06 |
| Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials Ki, Seokkan; Shim, Jaehwan; Oh, Seungtae; Koh, Eunjoo; Seo, Donghyun; Ryu, Seunggeol; Kim, Jaechoon; et al, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.170, pp.121012, 2021-05 |
| Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs) Lee, Jooyoung; Ki, Seokkan; Seo, Donghyun; Kim, Jaechoon; Nam, Youngsuk, APPLIED THERMAL ENGINEERING, v.173, 2020-06 |
| Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond Kim, Taeyoung; Song, Changhwan; Park, Sung Il; Lee, Seong Hyuk; Lee, Bong Jae; Cho, Jungwan, INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, v.143, 2023-04 |
| One-dimensional model of manifold microchannels for embedded cooling: Prediction of thermal performance and flow non-uniformity Lee, Hansol; Lee, Young Jin; Kim, Sung Jin, INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, v.155, 2024-06 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
| Thermal design of a hydrogen storage system using La(Ce)Ni-5 Kim, Joong Bae; Han, Gwangwoo; Kwon, YongKeun; Bae, Joongmyeon; Cho, EunAe; Cho, SungBaek; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.45, no.15, pp.8742 - 8749, 2020-03 |
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