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Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999 |
Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.29, no.10, pp.1207 - 1213, 2000 |
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