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Showing results 1 to 14 of 14

1	2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications Ukaegbu, Ikechi Augustine; Kim, Do-Won; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.23, no.19, pp.1403 - 1405, 2011-10
2	Asymmetric Regulation of Mobile Access Charges and Consumer Welfare with Price Regulation Lee, Jongyong; Lee, DukHee; Jung, Choong Young, ETRI JOURNAL, v.32, pp.447 - 456, 2010-06
3	Comments on "Hierarchical cubic networks" Yun, SK; Park, Kyu Ho, IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, v.9, no.4, pp.410 - 414, 1998-04
4	Controlled Lagrangian systems with gyroscopic forcing and dissipation Woolsey, C; Reddy, CK; Bloch, AM; Chang, Dong Eui; Leonard, NE; Marsden, JE, EUROPEAN JOURNAL OF CONTROL, v.10, no.5, pp.478 - 496, 2004
5	Double marginalization problems: evidence from the Korean fixed-to-mobile service market Park, MyeongCheol; Lee, SW, TELECOMMUNICATIONS POLICY, v.26, pp.607 - 621, 2002-12
6	Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly Jang, Kyung-Woon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, no.2, pp.339 - 346, 2009-06
7	Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04
8	Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03
9	Passively assembled optical inter-connection system based on an optical printed-circuit board Hwang, SH; Cho, MH; Kang, SK; Park, HyoHoon; Cho, HS; Kim, SH; Shin, KU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.5-8, pp.652 - 654, 2006-03
10	Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006
11	Pseudo-energy shaping for the stabilization of a class of second-order systems Chang, Dong Eui, INTERNATIONAL JOURNAL OF ROBUST AND NONLINEAR CONTROL, v.22, no.18, pp.1999 - 2013, 2012-12
12	RESTRICTION-FREE ADAPTIVE WORMHOLE ROUTING IN MULTICOMPUTER NETWORKS CHUNG, JH; Yoon, Hyunsoo; Maeng, SeungRyoul, INTERNATIONAL JOURNAL OF HIGH SPEED COMPUTING, v.7, no.1, pp.89 - 107, 1995-03
13	Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02
14	Synthesis of SWNT rings by noncovalent hybridization of porphyrins and single-walled carbon nanotubes Geng, Jianxin; Ko, Young-Koan; Youn, Sang-Cheon; Kim, Yun-Ho; Kim, Seong-A; Jung, Dae-Hwan; Jung, Hee-Tae, JOURNAL OF PHYSICAL CHEMISTRY C, v.112, no.32, pp.12264 - 12271, 2008-08

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