Browse by Subject CU ELECTRODEPOSITION
Showing results 1 to 3 of 3
| Improving accuracy of filling performance prediction in microvia copper electroplating Moon, Jeong-Ho; Shin, Jaewook; Kim, Tae-Hee; Song, DongHoon; Cho, EunAe, JOURNAL OF ELECTROANALYTICAL CHEMISTRY, v.871, 2020-08 |
| Preparation of copper foam with 3-dimensionally interconnected spherical pore network by electrodeposition Kim, Jeong-Han; Kim, Ryoung-Hee; Kwon, Hyuk-Sang, ELECTROCHEMISTRY COMMUNICATIONS, v.10, pp.1148 - 1151, 2008-08 |
| 티타늄의 수소 흡수와 구리 전착에 미치는 양극 산화의 영향 = Effects of anodic oxidation on the hydrogen absorption into Ti and its influence on electrodeposition of Culink 정준호; Jung, Jun-Ho; et al, 한국과학기술원, 2004 |
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