Showing results 226321 to 226340 of 279471
Hierarchically porous polymers containing triphenylamine for enhanced SF6 separation Chuah, Chong Yang; Yang, Yanqin; Bae, Tae-Hyun, MICROPOROUS AND MESOPOROUS MATERIALS, v.272, pp.232 - 240, 2018-12 |
Ferromagnetic to Paramagnetic Transition in Spherical Spin Glass Baik, Jinho; Lee, Ji Oon; Wu, Hao, JOURNAL OF STATISTICAL PHYSICS, v.173, no.5, pp.1484 - 1522, 2018-12 |
alpha-MnO2 Nanowire-Anchored Highly Oxidized Cluster as a Catalyst for Li-O-2 Batteries: Superior Electrocatalytic Activity and High Functionality Gu, Tae-Ha; Agyeman, Daniel Adjei; Shin, Seung-Jae; Jin, Xiaoyan; Lee, Jang Mee; Kim, Hyungjun; Kang, Yong-Mook; et al, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.57, no.49, pp.15984 - 15989, 2018-12 |
Potential Game-Based Non-Myopic Sensor Network Planning for Multi-Target Tracking Lee, Su-Jin; Park, Soon-Seo; Choi, Han-Lim, IEEE ACCESS, v.6, pp.79245 - 79257, 2018-12 |
Neural Grammatical Error Correction by Simulating the Human Learner and the Human Proofreader Gaim, Fitsum; 정진우; 박종철, 2018년 한국소프트웨어종합학술대회 논문집, pp.548 - 550, 한국정보과학회, 2018-12 |
감성 차원 조정을 통한 고정관념이 완화된 단어 임베딩 정진우; 이희제; 박종철, 2018년 한국소프트웨어종합학술대회, pp.545 - 547, 한국소프트웨어종합학술대회, 2018-12 |
Vapor-phase Deposited Functional Polymer Films for Industrial Applications Im, Sung Gap, Winter Workshop in Polymer Division, Korean Institute of Chemical Engineers, 2018-12 |
Implications of the dark axion portal for the muon g-2, B factories, fixed target neutrino experiments, and beam dumps deNiverville, Patrick; Lee, Hye-Sung; Seo, Min-Seok, PHYSICAL REVIEW D, v.98, no.11, pp.115011, 2018-12 |
Visible-Light-Induced C-O Bond Formation for the Construction of Five- and Six-Membered Cyclic Ethers and Lactones Im, Honggu; Kang, Dahye; Choi, Soyeon; Shin, Sanghoon; Hong, Sungwoo, ORGANIC LETTERS, v.20, no.23, pp.7437 - 7441, 2018-12 |
Predicting event mentions based on a semantic analysis of microblogs for inter-region relationships Jang, Gwan; Myaeng, Sung-Hyon, JOURNAL OF INFORMATION SCIENCE, v.44, no.6, pp.818 - 829, 2018-12 |
Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
MC-SDN: Supporting Mixed-Criticality Scheduling on Switched-Ethernet Using Software-Defined Networking Lee, Kilho; Park, Taejune; Kim, Minsu; Chwa, Hoon Sung; Lee, Jinkyu; Shin, Seungwon; Shin, Insik, 39th IEEE Real-Time Systems Symposium (RTSS), pp.288 - 299, IEEE, 2018-12 |
Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems Das, Mumpy; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Hong, Seokwoo; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
A dynamic programming algorithm for the maximum induced matching problem in permutation graphs Viet-Dung Nguyen; Ba-Thai Pham; Viet-Hung Tran; Phan-Thuan Do, 9th International Symposium on Information and Communication Technology (SoICT), pp.92 - 97, ASSOC COMPUTING MACHINERY, 2018-12 |
Development of a Wall-Climbing Drone Capable of Vertical Soft Landing Using a Tilt-Rotor Mechanism Myeong, Wancheol; Myung, Hyun, IEEE ACCESS, v.7, pp.4868 - 4879, 2018-12 |
UV-LEDs for the Disinfection and Bio-Sensing Applications Won, Wan-Sik; Tran, Le Giang; Park, Woo-Tae; Kim, Kyoung-Kook; Shin, Choongsoo S.; Kim, Namkeun; KIM, Young-Jin; et al, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.19, no.12, pp.1901 - 1915, 2018-12 |
Adaptive Static Analysis via Learning with Bayesian Optimization Heo, Kihong; Oh, Hakjoo; Yang, Hongseok; Yi, Kwangkeun, ACM TRANSACTIONS ON PROGRAMMING LANGUAGES AND SYSTEMS, v.40, no.4, 2018-12 |
깊이 정보 복원을 이용한 입자 군집 최적화 기법 기반의 물체와 상호작용하는 손 자세 추적 조우진; 박갑용; 우운택, 한국정보과학회 KSC2018, pp.1235 - 1237, 한국정보과학회, 2018-12 |
A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging Zhang, Shuye; Yang, Ming; Zhang, Yanxin; Wang, Qian; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12 |
Advances and Open Challenges for Integrated Circuits Detecting Bio-Molecules Carminati, Marco; Thewes, Roland; Rosenstein, Jacob; Yoo, Hoi-Jun, 25th IEEE International Conference on Electronics, Circuits and Systems (ICECS), pp.857 - 860, IEEE, 2018-12 |
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