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Showing results 1 to 3 of 3

1
A Study on Double Layer Non-Conductive Films (D-NCFs) for 3D-Through Silicon Via (TSV) Interconnection using Cu-pillar/SnAg Micro-Bump = 3D-Through Silicon Via (TSV) 미세피치 Cu-pillar/SnAg Micro-Bump 접속용 이중층 비전도 접속 필름 연구link

Se Yong, Lee; Paik, Kyoung Wook; et al, 한국과학기술원, 2018

2
Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding

Kim, Yoo Sun; Kim, Seung-Ho; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1350 - 1357, 2015-09

3
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

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