Browse by Subject simultaneous switching noise (SSN)
Showing results 1 to 20 of 20
| A 0.13-mu m CMOS 6 Gb/s/pin Memory Transceiver Using Pseudo-Differential Signaling for Removing Common-Mode Noise Due to SSN Ha, KS; Kim, Lee-Sup; Bae, SJ; Park, KI; Choi, JS; Jun, YH; Kim, K; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.44, pp.3146 - 3162, 2009-11 |
| A LOG-Induced SSN-Tolerant Transceiver for On-Chip Interconnects in COG-Packaged Source Driver IC for TFT-LCD Kim, Hyo-Eun; Oh, Jie-Hwan; Kim, Lee-Sup, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.60, no.1, pp.21 - 25, 2013-01 |
| A Wideband and Compact Partial Electromagnetic Bandgap Structure With a Narrow Via Pitch for a Signal Via Shield Hwang, Chul-Soon; Kim, Jae-Min; Song, Eak-Hwan; Shim, Yu-Jeong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.1, pp.241 - 244, 2011-02 |
| An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor Hwang, Chul-Soon; Shim, Yu-Jeong; Koo, Kyoung-Choul; Kim, Myung-Hoi; Pak, Jun-So; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.8, pp.439 - 441, 2011-08 |
| Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12 |
| Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method Kim, Jae-Min; Lee, Woo-Jin; Shim, Yu-Jeong; Shim, Jong-Joo; Kim, Ki-Yeong; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.647 - 659, 2010-08 |
| Chip-package hybrid clock distribution network and DLL for low jitter clock delivery Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.274 - 286, 2006-01 |
| Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.317 - 328, 2019-02 |
| Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications Park, J; Lu, ACW; Chua, KM; Wai, LL; Lee, J; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.481 - 483, 2006-09 |
| High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions Lee, J; Kim, H; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.15, pp.505 - 507, 2005-08 |
| Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02 |
| Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor Kim, Joungho; Jeong, Y, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.534 - 536, 2006-10 |
| Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08 |
| Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model Kim, Jae-Min; Jeong, You-Chul; Lee, Jun-Ho; Ryu, Chung-Hyun; Shim, Jong-Joo; Shin, Min-Chul; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.544 - 557, 2008-08 |
| Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08 |
| Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package Ryu, C; Park, J; Pak, JS; Lee, K; Oh, T; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, pp.855 - 857, 2007-12 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression Kim, Myung-Hoi; Koo, Kyoung-Choul; Kim, Joung-Ho; Kim, Ji-Seong, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.22, no.8, pp.403 - 405, 2012-08 |
| Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04 |
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