Browse by Subject recrystallization

Showing results 1 to 9 of 9

1
A composition window in the TiAl-Mo-Si system suitable for lamellar structure control through seeding and directional solidification

Lee, HN; Johnson, DR; Inui, H; Oh, MH; Wee, Dang-Moon; Yamaguchi, M, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.329 , no.SI, pp.19 - 24, 2002-06

2
Effect of Recrystallization and Natural Aging on Mechanical Properties of Al-Zn-Mg-Cu-Sc Alloys

Yu, Minkyu; Kwon, Oh Yeol; Park, Tae Won; Lee, Yong Yeon; Hong, Soon Hyung, KOREAN JOURNAL OF METALS AND MATERIALS, v.53, no.12, pp.844 - 850, 2015-12

3
Effects of nucleating agent on nonisothermal crystallization of syndiotactic polystyrene

Park, JY; Kwon, MH; Lee, YS; Park, OOk, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.17, no.3, pp.262 - 265, 2000-05

4
High-Angle Tilt Boundary Graphene Domain Recrystallized from Mobile Hot-Wire-Assisted Chemical Vapor Deposition System

Lee, Jin-Sup; Baek, Jinwook; Ryu, Gyeong Hee; Lee, Mi Jin; Oh, Seran; Hong, Seul Ki; Kim, Bo-Hyun; et al, NANO LETTERS, v.14, no.8, pp.4352 - 4359, 2014-08

5
Nonisothermal crystallization behavior of SPS/APS blends

Park, JY; Kwon, MH; Park, OOk, JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, v.38, no.23, pp.3001 - 3008, 2000-12

6
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films

Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.10, pp.3486 - 3499, 2015-10

7
Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

Kim, KS; Song, JY; Chung, EK; Park, JK; Hong, Soon-Hyung, MECHANICS OF MATERIALS, v.38, pp.119 - 127, 2006-01

8
Strain-Rate Dependence of Tensile Behavior in Commercial-Grade Tungsten-Effect of Recrystallization Condition

Kong, Byeong Seo; Shin, Ji Ho; An, Taejeong; Jang, Changheui; Kim, Hyoung Chan, MATERIALS, v.15, no.17, 2022-09

9
무연 복합 솔더의 미소경도에 미치는 기계적 변형과 온도의 영향

이주원; 강성권; 이혁모, Journal of the Microelectronics and Packaging Society, v.12, no.2, pp.121 - 128, 2005-06

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