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Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
Parallel-Plate MEMS Variable Capacitor With Superior Linearity and Large Tuning Ratio Using a Levering Structure Han, Chang-Hoon; Choi, Dong-Hoon; Yoon, Jun-Bo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.20, no.6, pp.1345 - 1354, 2011-12 |
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