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A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 |
플립칩 본딩에서 무연 솔더의 종방향 열초음파 솔더링에 관한 연구 = A study on longitudinal thermosonic soldering of lead free solder for flip chip bondinglink 이지혜; Lee, Ji-Hye; et al, 한국과학기술원, 2005 |
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