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Showing results 1 to 5 of 5

1
Fatigue and fracture assessment for reliability in electronics packaging

Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03

2
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05

3
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging

Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.183 - 194, 2006-12

4
가혹환경에서 FBGA 패키지의 흡습물성 및 이온 마이그레이션 신뢰성 평가 = Evaluation of hygroscopic properties and reliability for ionic migration of FBGA packages under harsh conditionlink

최종국; Choe, Jong-Guk; et al, 한국과학기술원, 2013

5
미세 무연 솔더볼이 계면 반응 및 솔더 조인트 신뢰성에 미치는 영향에 대한 연구 = Studies on the effects of fine size lead-free solder ball on the interfacial reactions and the solder joint reliabilitieslink

박용성; Park, Yong-Sung; et al, 한국과학기술원, 2013

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