Browse by Subject electrochemical migration▼aCOF▼aChip on film▼aIC package▼acorrosion▼aPCB▼aElectrinics corrosion▼aIntermetallic compound
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| Electrochemical migration and corrosion behavior of Sn-coated IC package substrate = 주석 도금된 반도체 패키지 기판의 전기화학적 마이그레이션 및 부식 거동link Kim, Jong Soo; Kwon, HyukSang; et al, 한국과학기술원, 2016 |
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