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Showing results 1 to 11 of 11

1
A measurement method for piezoelectric material properties under longitudinal compressive stress-a compression test method for thin piezoelectric materials

Kang, Lae-Hyong; Lee, Dae-Oen; Han, Jae-Hung, MEASUREMENT SCIENCE TECHNOLOGY, v.22, no.6, 2011-06

2
Brillouin scattering study on polycrystalline relaxor ferroelectrics

Ko JH; Kim DH; Kojima S; Kim JH; Choo, Woong Kil, JAPANESE JOURNAL OF APPLIED PHYSICS, v.42, no.5B, pp.3076 - 3079, 2003-05

3
Effect of Temperature and Aging on the Mechanical Properties of Concrete = 콘크리트의 역학적 성질에 미치는 온도와 재령의 효과link

Han, Sang-Hun; 한상훈; et al, 한국과학기술원, 2001

4
Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging

Shin, DK; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.21, no.4, pp.413 - 421, 1998-11

5
Geomechanical, Hydraulic and Thermal Characteristics of Deep Oceanic Sandy Sediments Recovered during the Second Ulleung Basin Gas Hydrate Expedition

Cha, Yohan; Yun, Tae Sup; Kim, Young Jin; Lee, Joo Yong; Kwon, Tae-Hyuk, ENERGIES, v.9, no.10, 2016-10

6
Impact of Isovalent and Aliovalent Doping on Mechanical Properties of Mixed Phase BiFeO3

Heo, Yooun; Hu, Songbai; Sharma, Pankaj; Kim, Kwang-Eun; Jang, Byung-Kweon; Cazorla, Claudio; Yang, Chan-Ho; et al, ACS NANO, v.11, no.3, pp.2805 - 2813, 2017-03

7
Indentation Damage of Porous Alumina Ceramics

하장훈; 김도경; Chul-Seung Lee; 김종호, 한국세라믹학회지, v.41, no.1, pp.19 - 23, 2004-01

8
A measurement method for piezoelectric material properties under longitudinal compressive stress–-a compression test method for thin piezoelectric materials

Kang, Lae-Hyong; Lee, Dae-Oen; Han, Jae-Hung, Measurement Science and Technology, Vol.22, No.6, 2011-04

9
Measuring elastic modulus of bacterial biofilms in a liquid phase using atomic force microscopy

Kim, Yong-Min; Kwon, Tae-Hyuk; Kim, Seungchul, GEOMECHANICS AND ENGINEERING, v.12, pp.863 - 870, 2017-05

10
Nanomechanical behavior of beta-SiC nanowire in tension: Molecular dynamics simulations

Kim, TY; Han, SS; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.5, pp.1442 - 1449, 2004-05

11
Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

Kim, KS; Song, JY; Chung, EK; Park, JK; Hong, Soon-Hyung, MECHANICS OF MATERIALS, v.38, pp.119 - 127, 2006-01

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