Browse by Subject delamination
Showing results 1 to 22 of 22
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| Behavior of composite structures orientations towards their failure and damage Baluch, Abrar-Ul-Haq Khan; Kim, Chun-Gon, JOURNAL OF COMPOSITE MATERIALS, v.49, no.29, pp.3703 - 3711, 2015-12 |
| Buckling and Postbuckling Behavior of Composite Laminates With A Delamination Hong, Chang Sun, COMPOSITES SCIENCE AND TECHNOLOGY, v.57, no.5, pp.557 - 564, 1997-01 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Combination of a time reversal process and a consecutive outlier analysis for baseline-free damage diagnosis Sohn, Hoon; Park, HW; Laws, KH; Farrar, CR, JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES, v.18, no.4, pp.335 - 346, 2007-04 |
| Damage analysis of a type 3 cryogenic propellant tank after LN2 storage test Kang, Sang-Guk; Kim, Myung-Gon; Park, Sang-Wuk; Kim, Chun-Gon; Kong, Cheol-Won, JOURNAL OF COMPOSITE MATERIALS, v.42, no.10, pp.975 - 992, 2008-05 |
| Damage assessment in layered composites using spectral analysis and Lamb wave Kim, Young-Han; Kim, Dae-Hyun; Han, Jung-Ho; Kim, Chun-Gon, COMPOSITES PART B-ENGINEERING, v.38, no.7-8, pp.800 - 809, 2007 |
| Delamination Characteristics of Single Layer and Stacked HTS Coated Conductor for Conduction Cooling Application Park, Heecheol; Jung, Hwanjun; Kim, Seokho; Park, Minwon; Lee, Sangjin; Ha, Hong-soo; Moon, Seung-Hyun; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.23, no.3, 2013-06 |
| Delamination Mechanics of Carbon Nanotube Micropillars Brown, Josef; Hajilounezhad, Taher; Dee, Nicholas T.; Kim, Sanha; Hart, A. John; Maschmann, Matthew R., ACS APPLIED MATERIALS & INTERFACES, v.11, no.38, pp.35221 - 35227, 2019-09 |
| Development of a line laser thermography system for structural damage detection under dynamic conditions = 동적 상태 구조물의 손상 감지를 위한 비접촉식 선형 레이저 열화상 시스템 개발link Hwang, Soonkyu; 황순규; et al, 한국과학기술원, 2016 |
| Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process Yoon, Tae-Shik; Shin, Woo-Cheol; Kim, Taek-Yong; Mun, Jeong-Hun; Kim, Taek-Soo; Cho, Byung-Jin, NANO LETTERS, v.12, no.3, pp.1448 - 1452, 2012-03 |
| Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages Jang, Kyung-Woon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, pp.74 - 80, 2009-04 |
| Foreign objects impact damage characteristics of aluminum/composite hybrid drive shaft Kim, HS; Kim, BC; Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.377 - 389, 2004-10 |
| Impact characteristics of glass fiber composites with respect to fiber volume fraction Lee, Dai Gil; Cheon, SS, JOURNAL OF COMPOSITE MATERIALS, v.35, no.1, pp.27 - 56, 2001 |
| Mechanical behavior of carbon/phenolic ablative composites for nozzle application Kim, PW; Hong, Soon-Hyung; Kim, YC; Yeh, BH; Won, YG, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.1153 - 1158, 2000-01 |
| Monitoring of impact damages in composite laminates using wavelet transform Sung, DU; Kim, Chun-Gon; Hong, Chang Sun, COMPOSITES PART B-ENGINEERING, v.33, no.1, pp.35 - 43, 2002 |
| On-line frequency estimation and adaptive vibration control of composite structures with delaminations Rew, KH; Han, Jae-Hung; Lee, In, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.1201 - 1206, 2000 |
| Prediction of compressive strength of stiffened composite plate after impact Hong, Chang Sun; Kong, CW; Kim, Chun-Gon, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.1189 - 1194, 2000 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
| Ultrathin, Flexible, and Transparent Oxide Thin-Film Transistors by Delamination and Transfer Methods for Deformable Displays Ko, Jong Beom; Lee, Seung Hee; Lee, Tae-Ik; Lee, Sangmin; Kim, Jingyu; Kim, Hyeok; Kim, Taek-Soo; et al, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.11, pp.2100431, 2021-11 |
| 열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상 김준모; 김보연; 정청하; 김구성; 김택수, 마이크로전자 및 패키징학회지, v.29, no.3, pp.25 - 29, 2022-09 |
| 일방향 복합재료 Single Lap 접합 조인트의 파손 모드 및 파손 강도 II. 파손 예측 김광수; 이영무; 김천곤, Composites Research, v.18, no.1, pp.1 - 9, 2005-02 |
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