Browse by Subject coefficient of thermal expansion
Showing results 1 to 10 of 10
| 350°C processable low-CTE transparent glass-fabric-reinforced hybrimer film for flexible substrates Kim, Hwea Yoon; Jin, Jungho; Park, Sang-Hee Ko; Eom, In Yong; Bae, Byeong-Soo, JOURNAL OF INFORMATION DISPLAY, v.16, no.1, pp.57 - 64, 2015-01 |
| Compaction of thick carbon/phenolic fabric composites with autoclave method Kim, JW; Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, pp.467 - 477, 2004-10 |
| Development of new device for measuring thermal stresses Kim, JHJ; Jeon, SE; Kim, Jin-Keun, CEMENT AND CONCRETE RESEARCH, v.32, no.10, pp.1645 - 1651, 2002-10 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03 |
| Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging Shin, DK; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.21, no.4, pp.413 - 421, 1998-11 |
| Liquid Crystalline Thermoset Films Based on Wholly Aromatic Copolymers Moon H.-G.; Ahn Y.-H.; Chang J.-H., POLYMER-KOREA, v.34, no.4, pp.369 - 375, 2010 |
| Mechanical property measurement of thin polymer composite laminates for warpage analysis of package substrates = 패키지 기판의 휨 분석을 위한 박형 폴리머 복합체 기판의 기계적 물성 측정link Lee, Taeik; 이태익; et al, 한국과학기술원, 2015 |
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| W-20wt%Cu 나노복합재료의 열적 기계적 특성 = Thermal and mechanical properties of W-20wt%Cu nanocompositeslink 이용언; Lee, Yong-Un; et al, 한국과학기술원, 2001 |
단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동 김준모; 구창연; 김택수, 마이크로전자 및 패키징학회지, v.27, no.3, pp.89 - 93, 2020-09 |
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