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Browse by Subject Through Silicon Via (TSV)▼aSignal Integrity▼aDeep Neural Network (DNN)▼aPotential Defect▼a2.5D & 3D Package

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Deep neural network (DNN)-based potential defect detection and classification method for through silicon via (TSV) in 2.5D & 3D packaging = 관통 실리콘 비아가 적용된 2.5 & 3차원 패키지에 대한 심층 신경망 기반의 잠재적인 결함 탐색 및 분류 방법link

Hwang, In-Tae; Kim, Joungho; et al, 한국과학기술원, 2021

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