DSpace at KOASAS
Browsing DSpace

Browse by Subject SPHEROIDS

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 5 of 5

1
CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

2
Hexagonally packed microwell plates for hypoxic microenvironment induction in tumorspheres

Won, Dongbin; Koh, Ilkyoo; Cha, Junghwa; Kim, Pilnam, JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.72, pp.67 - 72, 2019-04

3
In Vitro Reconstruction of Brain Tumor Microenvironment

Koh, Ilkyoo; Kim, Pilnam, BIOCHIP JOURNAL, v.13, no.1, pp.1 - 7, 2019-03

4
Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12

5
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08

Discover

rss_1.0 rss_2.0 atom_1.0