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Showing results 1 to 8 of 8

1
A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Hwang, Chul-Soon; Shim, Yu-Jeong; Kim, Joung-Ho; Kim, Jong-Hoon, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.54, no.3, pp.689 - 695, 2012-06

2
Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise

Kim, Myunghoi; Kim, Sukjin; Bae, Bumhee; Cho, Jonghyun; Kim, Joungho; Kim, Jaehoon; Ahn, Do Seob, ETRI JOURNAL, v.35, no.5, pp.827 - 837, 2013-10

3
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery

Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.274 - 286, 2006-01

4
High dielectric constant tape double-stacked EBG structure for broadband suppression of SSN in LTCC-based SiP applications

Park, J; Lu, ACW; Sunappan, V; Wai, LL; Kim, Joungho, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.50, pp.942 - 944, 2008-04

5
Hybrid analytical Modeling method for split power bus in multilayered package

Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02

6
Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08

7
Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12

8
Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model

Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02

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