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Showing results 1 to 12 of 12

1
An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards

Kim Y.-J.; Yoon H.-S.; Lee S.; Moon G.; Wee J.-K.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.1, pp.97 - 106, 2004-02

2
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery

Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.274 - 286, 2006-01

3
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06

4
Hexoctahedral Au Nanocrystals with High-Index Facets and Their Optical and Surface-Enhanced Raman Scattering Properties

Hong, Jong Wook; Lee, Su-Un; Lee, Young Wook; Han, Sang Woo, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.134, no.10, pp.4565 - 4568, 2012-03

5
Matrix substitution method for power bus analysis with isolated power island in high-speed packages and PCBs

Jeong, Y; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.31 - 33, 2006-01

6
Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08

7
Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12

8
Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04

9
Nanoindentation study of cementite size and temperature effects in nanocomposite pearlite: A molecular dynamics simulation

Ghaffarian, Hadi; Taheri, Ali Karimi; Ryu, Seunghwa; Kang, Keonwook, CURRENT APPLIED PHYSICS, v.16, no.9, pp.1015 - 1025, 2016-09

10
Power distribution networks for system-on-package: Status and challenges

Swaminathan, M.; Kim, Joungho; Novak, I.; Libous, J.P., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.2, pp.286 - 300, 2004-05

11
THE ERDOS-SZEKERES PROBLEM FOR NON-CROSSING CONVEX SETS

Dobbins, Michael Gene; Holmsen, Andreas F; Hubard, Alfredo, MATHEMATIKA, v.60, no.2, pp.463 - 484, 2014-07

12
Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04

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