Browse by Subject PLANAR CIRCUITS
Showing results 1 to 2 of 2
| Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02 |
| Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model Kim, Jae-Min; Jeong, You-Chul; Lee, Jun-Ho; Ryu, Chung-Hyun; Shim, Jong-Joo; Shin, Min-Chul; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.544 - 557, 2008-08 |
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