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Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints Kim, Sung-Hwan; Yu, Jin, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09 |
Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 |
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