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Showing results 1 to 3 of 3

1
Chip warpage model for reliability prediction of delamination failures

Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04

2
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05

3
THE COOLING OF A HEAT-GENERATING BOARD INSIDE A PARALLEL-PLATE CHANNEL

BEJAN, A; MOREGA, AM; LEE, SW; Kim, SungJin, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.14, no.2, pp.170 - 176, 1993-06

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