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Showing results 1 to 5 of 5

1
Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films

Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04

2
Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films

Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09

3
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints

Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10

4
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

5
Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films

Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02

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