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Applicability of the interface spring model for micromechanical analyses with interfacial imperfections to predict the modified exterior Eshelby tensor and effective modulus Lee, Sangryun; Kim, Youngsoo; Lee, Jinyeop; Ryu, Seunghwa, MATHEMATICS AND MECHANICS OF SOLIDS, v.24, no.9, pp.2944 - 2960, 2019-09 |
Strain rate and adhesive energy dependent viscoplastic damage modeling for nanoparticulate composites: Molecular dynamics and micromechanical simulations Yang, Beomjoo; Shin, H.; Kim, Hyungjun; Lee, Haeng-Ki, APPLIED PHYSICS LETTERS, v.104, no.10, 2014-03 |
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