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(A) Study on grain refinemnet and thermal stability improvement in longitudinal recording meida = 수평자기기록매체에서 결정립도 미세화 및 열적 안정성 향상에 관한 연구link Oh, Se-Chung; 오세충; et al, 한국과학기술원, 2003 |
Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; Son, Kirak; Seo, Jeongmin; Kim, Taek-Soo; Park, Young-Bae, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07 |
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