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To cut or Not to cut: A Thermomechanical Stresss Analysis of Polyimide Thin Film on Ceramic Structures

Paik, Kyung-Wook; Pecht, Michael; Bhandarkar, S. Navin; Wu, Xin, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.18, no.1, pp.150 - 153, 1995-01

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