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A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process Kim, K. H.; Yu, Jin; Kim, J. H., SCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511, 2010-09 |
Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM Kim, J. H.; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343, 2014-11 |
금속 전도 층에 따른 무전해 Ni(P)의 morphology 변화가 Black pad 현상에 미치는 영향에 관한 연구 = Effects of Nickel-Phosphorus morphology on Black pad phenomena using conductive metal layerslink 김경덕; Kim, Kyoung-Doc; et al, 한국과학기술원, 2013 |
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