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Showing results 1 to 4 of 4

1
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments

Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04

2
Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide

Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE, v.35, no.8, pp.1949 - 1955, 2000-04

3
Oxidation study of pure tin and its alloys via electrochemical reduction analysis

Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05

4
The oxidation of lead-free Sn alloys by electrochemical reduction analysis

Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOM, v.57, no.6, pp.50 - 52, 2005-06

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