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(A) study on residual stresses in electroless Ni(P) and Ni(P)/Sn films and peel strengths of Cu/Cr/Polyimide system = 무전해 Ni(P) 및 Ni(P)/Sn 박막의 잔류응력과 Cu/Cr/Polyimide 계의 필강도 해석에 대한 연구link Song, Jae-Yong; 송재용; et al, 한국과학기술원, 2003 |
Investigation of flip chip under bump metallization systems of Cu pads Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37, 2002-03 |
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