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Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
(UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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