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Showing results 17 to 20 of 20

17
Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package

Ryu, C; Park, J; Pak, JS; Lee, K; Oh, T; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, pp.855 - 857, 2007-12

18
Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09

19
Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression

Kim, Myung-Hoi; Koo, Kyoung-Choul; Kim, Joung-Ho; Kim, Ji-Seong, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.22, no.8, pp.403 - 405, 2012-08

20
Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04

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