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Showing results 4 to 6 of 6

4
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

5
Non-destructive micro-Raman analysis of Si near Cu through silicon via

Kim, Jae Hyun; Yoo, Woo Sik; Han, Seung Min, ELECTRONIC MATERIALS LETTERS, v.13, no.2, pp.120 - 128, 2017-03

6
Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio

Kim, Taeyeong; Lee, Jungchul, MICRO AND NANO SYSTEMS LETTERS, v.10, no.1, 2022-09

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