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Enhancement of adhesion strength of electroless-plated Ni under bump metallurgy by introduction of inductively coupled plasma enhanced bias sputtering Ni seed layer Kim, ED; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.44, no.50-52, pp.1541 - 1543, 2005-12 |
티타늄 부동태 피막의 반도체적 특성과 재부동태 속도론에 관한 연구 = A study on semiconducting properties of passive film on Ti and its repassivation kineticslink 김동영; Kim, Dong-Yung; et al, 한국과학기술원, 2001 |
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