Showing results 1 to 1 of 1
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
Discover