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Showing results 88 to 88 of 88

88
전자패키지 Ball grid array 소더 조인트의 기계적 피로 특성에 관한 연구 = A study on mechanical fatigue behaviors of ball grid array solder joints for electronic packaginglink

박태상; Park, Tae-Sang; et al, 한국과학기술원, 2004

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