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Showing results 84161 to 84180 of 101590

84161
Thermosensitive pluronic micelles stabilized by shell cross-linking with gold nanoparticles

Bae, Ki-Hyun; Choi, Seung-Ho; Park, Sung-Young; Lee, Yu-Han; Park, Tae-Gwan, LANGMUIR, v.22, no.14, pp.6380 - 6384, 2006-07

84162
Thermosensitive sol-gel transition behaviors of poly(ethylene oxide)/aliphatic polyester/poly (ethylene oxide) aqueous solutions

Song, MJ; Lee, DS; Ahn, JH; Kim, DJ; Kim, Sung Chul, JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY, v.42, no.3, pp.772 - 784, 2004-02

84163
Thermosensitive, Stretchable, and Piezoelectric Substrate for Generation of Myogenic Cell Sheet Fragments from Human Mesenchymal Stem Cells for Skeletal Muscle Regeneration

Yoon, Jeong-Kee; Misra, Mirnmoy; Yu, Seung Jung; Kim, Han Young; Bhang, Suk Ho; Song, Seuk Young; Lee, Ju-Ro; et al, ADVANCED FUNCTIONAL MATERIALS, v.27, no.48, 2017-12

84164
Thermoset elastomers covalently crosslinked by hard nanodomains of triblock copolymers derived from carvomenthide and lactide: tunable strength and hydrolytic degradability

Jang, Jeongmin; Park, Hyejin; Jeong, Haemin; Mo, Eunbi; Kim, Yongbin; Yuk, Jeong Suk; Choi, Siyoung Q.; et al, POLYMER CHEMISTRY, v.10, no.10, pp.1245 - 1257, 2019-03

84165
Thermoset Elastomers Derived from Carvomenthide

Yang, Jinyoung; Lee, Sangjun; Choi, Woo Jin; Seo, Howon; Kim, Pilhan; Kim, Geon-Joong; Kim, Young-Wun; et al, BIOMACROMOLECULES, v.16, no.1, pp.246 - 256, 2015-01

84166
Thermosonic bonding of crossed strip Au bumps

Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005

84167
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01

84168
Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding

Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008

84169
Thermostability of an alkaline protease, AprP, is enhanced by replacements of Ser307 and Ser331 at the cleavage sites

Ko, JH; Park, S; Kim, EK; Jang, WH; Kang, JH; Yoo, Ook-Joon, BIOTECHNOLOGY LETTERS, v.24, no.21, pp.1749 - 1755, 2002-11

84170
THERMOSTABLE D-HYDANTOINASE FROM THERMOPHILIC BACILLUS-STEAROTHERMOPHILUS SD-1 - CHARACTERISTICS OF PURIFIED ENZYME

LEE, SG; LEE, DC; HONG, SP; SUNG, MH; Kim, Hak-Sung, APPLIED MICROBIOLOGY AND BIOTECHNOLOGY, v.43, no.2, pp.270 - 276, 1995-06

84171
THERMOVISCOPLASTIC ANALYSIS OF HYPERSONIC STRUCTURES SUBJECTED TO SEVERE AERODYNAMIC HEATING

Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, JOURNAL OF AIRCRAFT, v.27, no.9, pp.826 - 835, 1990-09

84172
Thermowetting embossing nanoimprinting of the organic-inorganic hybrid materials

Kim, WS; Kim, KS; Kim, YC; Bae, Byeong-Soo, THIN SOLID FILMS, v.476, no.1, pp.181 - 184, 2005-04

84173
Theroretical Study of Hydration of RNA

K. M. Kim; M. S. Jhon, BIOCHIMICA ET BIOPHYSICA ACTA, v.565, no.1, pp.131 - 147, 1979

84174
theta-curve polynomials and finite-type invariants

Huh, Y; Jin, Gyo Taek, JOURNAL OF KNOT THEORY AND ITS RAMIFICATIONS, v.11, no.4, pp.555 - 564, 2002-06

84175
THF + H2 이성분계 크러스레이트 하이드레이트의 상거동 및 구조 분석

이흔; 연순화; 박영준; 차민준; 차종호, KOREAN CHEMICAL ENGINEERING RESEARCH(HWAHAK KONGHAK), v.46, no.6, pp.1095 - 1099, 2008-12

84176
Thiacrownether-mediated size-controlled assembly of gold nanoparticles

In, I; Jun, YW; Kim, YJ; Kim, Sang Youl, CHEMISTRY LETTERS, v.33, no.11, pp.1530 - 1531, 2004-11

84177
Thiazole-Linked Covalent Organic Framework Promoting Fast Two-Electron Transfer for Lithium-Organic Batteries

Singh, Vikram; Kim, Jaewook; Kang, Bora; Moon, Joonhee; Kim, Sujung; Kim, Woo Youn; Byon, Hye Ryung, ADVANCED ENERGY MATERIALS, v.11, no.17, 2021-05

84178
Thick film planar CO2 sensors based on Na beta-alumina solid electrolyte

Hong, HS; Kim, JW; Jung, SJ; Park, Chong-Ook, JOURNAL OF ELECTROCERAMICS, v.15, no.2, pp.151 - 157, 2005-11

84179
Thick SmBCO/IBAD-MgO Coated Conductor for High Current Carrying Power Applications

Ha, HS; Lee, JH; Ko, RK; Kim, HS; Kim, HK; Moon, SH; Park, C; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.20, pp.1545 - 1548, 2010-06

84180
Thick, three-dimensional nanoporous density-graded materials formed by optical exposures of photopolymers with controlled levels of absorption

Nam, Yun-Suk; Jeon, Seokwoo; Shir, Daniel Jay-Lee; Hamza, Alex; Rogers, John A., APPLIED OPTICS, v.46, no.25, pp.6350 - 6354, 2007-09

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