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Showing results 53541 to 53560 of 100328

53541
Modeling Acoustic Transitions in Speech by Modified Hidden Markov Models with State Duration and State Duration and State Duration-Dependent Observation Probabilities

j. h. lee; c. k. un, JOURNAL OF LIGHTWAVE TECHNOLOGY, 1996-07

53542
Modeling adsorption properties of structurally deformed metal-organic frameworks using structure-property map

Jeong, WooSeok; Lim, Dae-Woon; Kim, Sungjune; Harale, Aadesh; Yoon, Minyoung; Suh, Myunghyun Paik; Kim, Jihan, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.114, no.30, pp.7923 - 7928, 2017-07

53543
Modeling Air-Traffic Service Time Uncertainties for Queuing Network Analysis

Kim, Jinwhan; Tandale, Monish; Menon, P. K., IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, v.48, no.1, pp.525 - 541, 2012-01

53544
Modeling allosteric signal propagation using protein structure networks

Park, Keun-Wan; Kim, Dong-Sup, BMC BIOINFORMATICS, v.12, 2011-02

53545
MODELING AND ADAPTIVE POLE ASSIGNMENT CONTROL IN TURNING

HWANG, HY; Oh, Jun-Ho; Kim, Kwang-joon, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.29, no.2, pp.275 - 285, 1989

53546
MODELING AND ANALYSIS OF A NONLINEAR ELASTOMER IMPACT MODEL WITH A DAMPING MECHANISM

Sung, Dan Keun, IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, v.E75A, no.8, pp.1020 - 1025, 1992-08

53547
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12

53548
Modeling and Analysis of a Tandom Link Connection under the Burst-Error Condition

Y.J.Cho; C.K.Un, IEEE TRANSACTIONS ON COMMUNICATIONS, v.42, no.2, pp.360 - 366, 1994-02

53549
Modeling and Analysis of an Energy-Efficient Mobility Management Scheme in IP-Based Wireless Networks

Hwang, Ho Young; Kwon, Sun-Jong; Chung, Yun Won; Sung, Dan Keun; Park, Suwon, SENSORS, v.11, no.12, pp.11273 - 11294, 2011-12

53550
Modeling and Analysis of Mobile Terminal Power ON/OFF-State Management Considering User Behavior

Chung, Yun Won; Chun, Min Young; Sung, Dan Keun, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.57, no.6, pp.3708 - 3722, 2008-11

53551
Modeling and analysis of mobility management state of packet-switched (PS) services in GPRS

Chung, Yun Won; Hwang, Ho Young; Sung, Dan Keun, COMPUTER COMMUNICATIONS, v.30, no.1, pp.166 - 177, 2006-12

53552
Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08

53553
Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Shim, Yu-Jeong; Park, Jong-Bae; Kim, Jae-Min; Song, Eak-Hwan; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.51, no.3, pp.763 - 773, 2009-08

53554
Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Shim, Yujeong; Park, Jongbae; Kim, Jaemin; Song, Eakhwan; Yoo, Jeongsik; Pak, Junso; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, Vol.51, No.3, pp.763-773, 2009-08

53555
Modeling and analysis of software fault detection and correction, process by considering time dependency

Wu Y.P.; Hu Q.P.; Xie M.; Ng S.H., IEEE TRANSACTIONS ON RELIABILITY, v.56, no.4, pp.629 - 642, 2007

53556
Modeling and analysis of static and dynamic characteristics for buck-type three-phase PWM rectifier by circuit DQ transformation

Han, SB; Choi, NS; Rim, Chuntaek; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.13, no.2, pp.323 - 336, 1998-03

53557
Modeling and analysis of the dynamic location registration and paging in microcellular systems

Kim, SJ; Lee, Chae Young, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.45, no.1, pp.82 - 90, 1996-02

53558
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02

53559
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

53560
Modeling and analysis of two-location algorithm with implicit registration in CDMA personal communication network

Jang, Hee-Seon; Hwang, Hark; Jun, Kyung-Pyo, COMPUTERS & INDUSTRIAL ENGINEERING, v.41, no.1, pp.95 - 110, 2001-10

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