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Showing results 46521 to 46540 of 100221
| Interfacial Rashba magnetoresistance of the two-dimensional electron gas at the LaAlO3/SrTiO3 interface Narayanapillai, Kulothungasagaran; Go, Gyungchoon; Ramaswamy, Rajagopalan; Gopinadhan, Kalon; Go, Dongwook; Lee, Hyun-Woo; Venkatesan, Thirumalai; et al, PHYSICAL REVIEW B, v.96, no.6, 2017-08 |
| Interfacial reaction and control of Pt/PZT/Pt by sol-gel process No, Kwangsoo; Ding, Ai-Li; Luo, Wei-Gen; Qiu, Ping-Sun, AMF-2, 1998 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between aluminum metal and boron-doped polysilicon in a planar type antifuse device Baek, JT; Park, HH; Ahn, Byung Tae; Jun, CH; Kim, YT; Song, YH; Kim, J, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.5A, pp.2451 - 2454, 1998-05 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Interfacial reaction between Sn-Ag-based solder alloys and substrates Choi, WK; Lee, HyuckMo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.S, pp.344 - 2, 1999-07 |
| Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system Baek, Jong Tae; Park, Hyung-Ho; Cho, Kyung-Ik; Yoo, Hyung Joun; Kang, Sang-Won; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.78, no.12, pp.7074 - 7079, 1995-12 |
| Interfacial reaction of Sn-3.5wt%Ag solder alloy with a variance of Ni layer thickness Choi, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.11, pp.1416 - 1421, 1999-11 |
| Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding S.T. Kim; Kim, Chong Hee, JOURNAL OF MATERIALS SCIENCE, v.27, no.8, pp.2061 - 2066, 1992 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
| Interfacial Reactions of Ozone with Surfactant Protein B in a Model Lung Surfactant System Kim, Hugh I.; Kim, Hyungjun; Shin, Young Shik; Beegle, Luther W.; Neidholdt, Evan L.; Goddard, William A.; Heath, James R.; et al, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.132, no.7, pp.2254 - 2263, 2010-02 |
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Interfacial rheology of coexisting solid and fluid monolayers Sachan, A. K.; Choi, Siyoung Q.; Kim, KH; Tang, Q; Hwang, L; Lee, KYC; Squires, TM; et al, SOFT MATTER, v.13, no.7, pp.1481 - 1492, 2017-01 |
| Interfacial roughening induced by the reaction of end-functionalized polymers at a PS/P2VP interface: Quantitative analysis by DSIMS Kim, Bumjoon; Kang, HM; Char, K; Katsov, K; Fredrickson, GH; Kramer, EJ, MACROMOLECULES, v.38, no.14, pp.6106 - 6114, 2005-07 |
| Interfacial shear rheology of perfluorosulfonic acid ionomer monolayers at the air/water interface Kim, Baekmin Q.; Chae, Junsu; Kim, Jongmin Q.; Kim, KyuHan; Choi, Siyoung Q., JOURNAL OF RHEOLOGY, v.63, no.6, pp.947 - 959, 2019-11 |
Interfacial Shearing Behavior along Xanthan Gum Biopolymer-Treated Sand and Solid Interfaces and Its Meaning in Geotechnical Engineering Aspects Lee, Minhyeong; Im, Jooyoung; Cho, Gye-Chun; Ryu, Hee Hwan; Chang, Ilhan, APPLIED SCIENCES-BASEL, v.11, no.1, pp.139, 2021-01 |
| Interfacial stability of ultrathin films of magnetite Fe3O4 (111) on Al2O3(001) grown by ozone-assisted molecular-beam epitaxy Hong, Hawoong; Kim, Jongjin; Fang, Xinyue; Hong, Daniel Seungbum; Chiang, T-C, APPLIED PHYSICS LETTERS, v.110, no.2, 2017-01 |
| INTERFACIAL STAGES OF THE ZNTE/GAAS STRAINED HETEROSTRUCTURES GROWN BY TEMPERATURE-GRADIENT VAPOR TRANSPORT DEPOSITION AT LOW-TEMPERATURE KIM, TW; PARK, HL; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.64, no.19, pp.2526 - 2528, 1994-05 |
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