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Showing results 46521 to 46540 of 100230
| Interfacial perpendicular magnetic anisotropy in CoFeB/MgO structure with various underlayers Oh, Young-Wan; Lee, Kyeong-Dong; Jeong, Jong-Ryul; Park, Byong-Guk, JOURNAL OF APPLIED PHYSICS, v.115, no.17, pp.17C724, 2014-05 |
| Interfacial plasticity mediated by lath boundaries in reduced-activation ferritic/martensitic steels Ghaffarian, Hadi; Na, Ye-Eun; Jang, Dongchan, JOURNAL OF NUCLEAR MATERIALS, v.559, 2022-02 |
| Interfacial Polymerization of Reactive Block Polymers for the Preparation of Composite Ultrafiltration Membranes Seo, Myungeun; Moll, David; Silvis, Craig; Roy, Abhishek; Querelle, Sarah; Hillmyer, Marc A., INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, v.53, no.48, pp.18575 - 18579, 2014-12 |
| Interfacial properties of liquid metal immersed in various liquids Ryu, Gaabhin; Park, Kwangseok; Kim, Hyoungsoo, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.621, pp.285 - 294, 2022-09 |
| INTERFACIAL PROPERTIES OF MODEL GRAFT-COPOLYMERS CAO, BH; Kim, Mahn-Won; PEIFFER, DG, LANGMUIR, v.11, no.5, pp.1645 - 1652, 1995-05 |
| Interfacial Rashba magnetoresistance of the two-dimensional electron gas at the LaAlO3/SrTiO3 interface Narayanapillai, Kulothungasagaran; Go, Gyungchoon; Ramaswamy, Rajagopalan; Gopinadhan, Kalon; Go, Dongwook; Lee, Hyun-Woo; Venkatesan, Thirumalai; et al, PHYSICAL REVIEW B, v.96, no.6, 2017-08 |
| Interfacial reaction and control of Pt/PZT/Pt by sol-gel process No, Kwangsoo; Ding, Ai-Li; Luo, Wei-Gen; Qiu, Ping-Sun, AMF-2, 1998 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between aluminum metal and boron-doped polysilicon in a planar type antifuse device Baek, JT; Park, HH; Ahn, Byung Tae; Jun, CH; Kim, YT; Song, YH; Kim, J, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.5A, pp.2451 - 2454, 1998-05 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Interfacial reaction between Sn-Ag-based solder alloys and substrates Choi, WK; Lee, HyuckMo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.S, pp.344 - 2, 1999-07 |
| Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system Baek, Jong Tae; Park, Hyung-Ho; Cho, Kyung-Ik; Yoo, Hyung Joun; Kang, Sang-Won; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.78, no.12, pp.7074 - 7079, 1995-12 |
| Interfacial reaction of Sn-3.5wt%Ag solder alloy with a variance of Ni layer thickness Choi, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.11, pp.1416 - 1421, 1999-11 |
| Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding S.T. Kim; Kim, Chong Hee, JOURNAL OF MATERIALS SCIENCE, v.27, no.8, pp.2061 - 2066, 1992 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
| Interfacial Reactions of Ozone with Surfactant Protein B in a Model Lung Surfactant System Kim, Hugh I.; Kim, Hyungjun; Shin, Young Shik; Beegle, Luther W.; Neidholdt, Evan L.; Goddard, William A.; Heath, James R.; et al, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.132, no.7, pp.2254 - 2263, 2010-02 |
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Interfacial rheology of coexisting solid and fluid monolayers Sachan, A. K.; Choi, Siyoung Q.; Kim, KH; Tang, Q; Hwang, L; Lee, KYC; Squires, TM; et al, SOFT MATTER, v.13, no.7, pp.1481 - 1492, 2017-01 |
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- 31,300 2020 - 2024
- 99,975 2010 - 2019
- 75,670 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969